SMBB Technology

Better light trapping and current collection to improve
module power output and reliability.

PID Resistance

Excellent Anti-PID performance guarantee via
optimized mass-production process and materials
control.

Higher Power Output

Module power increases 5-25% generally, bringing
significantly lower LCOE and higher IRR.

Hot 2.0 Technology

The N-type module with Hot 2.0 technology has better
reliability and lower LID/LETID.

Enhanced Mechanical Load

Certified to withstand: wind load (2400 Pascal) and snow
load (5400 Pascal).